The Bostik Born2Bond™ UV Cure-In-Place Gasket (UV-CIPG) range is a revolutionary gasket system, commonly used in applications that require a fast, cost effective and cutting edge solution such as in electronics manufacturing and automotive sectors.
The UV-CIPG adhesives can be easily applied with an automated dispenser which can be programmed to follow a specific application area. This method of application can save many hours of preparation and applying the gasket onto a product housing, and also helps to reduce the volume of materials used. The gasket is cured immediately during application using UV light.
The Born2Bond™ UV-CIPG range is Bostik’s latest innovation in engineering adhesives and has been designed to address the detailed and precise bonding requirements demanded by modern industry.
Bostik Born2Bond™ UV-CIPG Solutions: How does it work?
For water and dust proofing applications, moulded and cut gaskets are widely used. These gaskets are typically assembled by hand. However, moulded gaskets are labour intensive.
Moulded Gaskets
- Labour intensive
- High labour cost
- High defect rate
- Mould cost
Bostik Born2Bond™ UV-CIPG has been developed to meet the demands of modern manufacturing processes: high efficiency, automated processes, complex designs, smaller size, lightweight, less waste, and water/dust proof.
With products that offer excellent elasticity and easy dispensability, along with exceptional quality, durability and strength, Born2Bond™ UV-CIPG is emerging as a top choice for industry players.
Bostik Born2Bond™ UV-CIPG
- UV curable
- Low labour cost
- No mould
- High precision
- Automatic robot dispensing
Key features
- Extremely flexible and tough, it does not crack even when compressed or deformed
- High thixotropic indexes enable the creation of complex gaskets on flat surfaces or shallow grooves
- Immediate curing using UV light
- Enables micro-dispensing
Key benefits
Application and equipment
Bostik Born2Bond™ UV-CIPG Solutions can be dispensed using all technologies, and Bostik can adjust the formula to cure at a specific wavelength if required.
| Dispensing and curing equipment | ||
|
Dispensing Head
|
Air
|
Cost effective |
| Does not need cleaning | ||
|
Mechanical
|
Precise | |
| High viscosity | ||
|
Jetting
|
Suitable for ultra-fine dispensing | |
| Unaffected by irregularities on the substrate | ||
|
3-Axis Robot
|
N/A
|
Can be enabled to dispense automatically |
| Can be pre-programmed to dispense in a complex pattern | ||
|
UV-Curing Device
|
Metal-halide
|
Low tackiness at multiple wavelengths |
| Quick curing time | ||
| Can be cured completely | ||
|
LED
|
No heating during UV irradiation, therefore no damage | |
| Affordable and durable | ||
Automated application process
- Making a programme. Design precise application areas
- Dispensing UV-CIPG. Dispense automatically and accurately
- Irradiating UV. Cure immediately with UV light
Why Born2Bond™ UV-CIPG Solutions?
INNOVATION
Bostik is leading the way in pioneering materials science. As we expand, diversify and innovate, our lead adhesive technologies evolve with us to address manufacturers’ ever-changing needs.
TECHNOLOGY (SOLUTIONS)
Innovation is is our DNA. We are on a constant quest to find newer and smarter ways of doing things. With our focus on centralised R&D and materials science, our innovation strategy can be broken down into three distinct levels:
- Adhesive research and technology development
- Product development and innovation
- Technical support
LEADERSHIP
As an industry leader, Bostik understands the macro changes which influence the markets and industry; and provides innovative smart solutions to meet these pressing challenges for electronic and automotive manufacturers.
Bostik’s Worldwide Technical Service network of industry and application experts are organised by market segments to bring dedicated support in all process and manufacturing specificities.
Our extensive technologies portfolio and adhesive expertise are at your service to define the best solution for each and every single situation. For more information, please contact Bostik today.
Bostik Born2Bond™ latest UV-CIPG Solution
AU588
The new AU588 gasket solution is the latest innovation in engineering adhesives as part of the company’s goal to create smart solutions for Industry 4.0, globally.
AU588 is UV reactive and delivers high seal performance and exceptional elasticity. It also offers reliable durability in high-temperature environments and excellent hydrolysis resistance. Its unique balance of high elongation and high tensile strength ensures that it will not crack even when exposed to high compression ratios.
