In industries where thermal management is critical, reliable solutions are key to achieving long-term performance and protecting sensitive components. At DGE Specialty Chemicals, we are proud to offer DOWSIL™ Thermally Conductive Encapsulants—engineered silicone-based materials that deliver outstanding protection, heat dissipation, and versatility across various applications.
What are thermally conductive encapsulants?
Thermally conductive encapsulants are flowable materials designed to facilitate high-volume automated production. They serve as a lightweight, flexible alternative to pre-cured pads, providing efficient thermal coupling for electronic components while ensuring robust protection.
Key benefits of thermally conductive encapsulants
- Low Viscosity: Easy application for streamlined production processes.
- Dual Functionality: Combine heat dissipation with long-term mechanical protection.
- Durable Across Extreme Conditions: Resistant to shock, oxidation, and moisture, and performs consistently from -40ºC to 200ºC.
- Primerless Options: Simplifies the application process.
These encapsulants are designed to meet the most demanding requirements in automotive, solar, power, industrial, and aviation applications.
Applications of thermally conductive encapsulants
From the rapidly evolving electric vehicle industry to high-performance solar panels, these encapsulants are widely used in:
- Automotive components like inverters, ECUs, and OCBs
- Solar energy systems, including panels and power inverters
- Industrial electronics for power modules.
- Aviation systems requiring lightweight and reliable thermal management solutions.
DGE Specialty Chemicals: your trusted partner
As a leading specialty chemicals distributor, DGE partners with world-class manufacturers like Dow to provide cutting-edge materials tailored to meet your specific needs. We combine a global supply network, technical expertise, and customer-focused service to deliver solutions for today’s most demanding applications.
Our Product Range
The DOWSIL™ encapsulants portfolio includes:
- DOWSIL™ TC-6011: Excellent flowability and thermal conductivity for lightweight designs.
- DOWSIL™ TC-6020: Superior heat dissipation for high-power systems.
- DOWSIL™ TC-6040: High-performance thermal coupling with advanced durability.
- DOWSIL™ TC-6015: A two part product, room temperature curable and heat fast cure, self-adhesion, low specific gravity thermal conductive encapsulant.
- DOWSIL™ TC-6032: A two-part, 1 to 1 mix ratio dielectric gel that is suitable for sealing and protecting various electronic devices, especially those with delicate components.
Each product is designed to optimize thermal conductivity, viscosity, and mechanical strength, ensuring a perfect fit for your application.
