DOWSIL™ EC-8425 is a new 1-part heat cure Electrically Conductive Adhesive for grounding, bonding and shielding interference applications with durable mechanical and conductive properties and reliable performance at high temperature and vibration.
Key benefits
- Durable mechanical and conductive properties
- Reliable performance that can withstand high temperature and vibration
- Strong adhesion
- Strong electromagnetic shielding across a wide range of frequencies
- Cure at medium temperatures (~90°C)
- 20% elongation at medium cure T° to enable flexibility at joints
- Balancing cost and performance
- Added UV indicator for ease of inspection
- Solvent-free
Automotive Applications
- EMI/EMC shielding
- Electrical connection – grounding
Targeting
- ADAS (Advanced Driver Assistance Systems) ▪ Inverter/Converter
- Electronic Control Unit
- Sensors
DOWSIL™ EC-8425 Electrically Conductive Adhesive
- Durable mechanical and conductive properties, reliable performance
- Withstands high temperature and vibration
- Balanced cost and performance enable use in wide variety of grounding applications
- Cure at medium temperatures ≥ 90 °C (gelation onset 80°C, 30 min)
- Greater than 20% elongation to enable flexibility at joints
- Potential applications include solder and mechanical fastener replacement
- Formulated with blend of silver & sliver platted filler
Properties
Property comparisons
Adhesive rheology
Viscosity:
- 2800 Pa.s @ 0.1(1/s)
- 400 Pa.s @ 1 (1/s)
Thixotropic index (0.1/1): 7
Electrically Conductive Adhesive
Open time
- >5 Days at room temperature
- Increase of viscosity/decrease of extrusion is leading factor
- Stable adhesion and bond line thickness
Adhesive cure properties
- Stable properties under various cure conditions
- Initial variation in adhesion vs cure condition recovered with time at cure temperature
Adhesive shielding effectiveness
- Strong shielding across wide range of frequency
- Average -81dB (frequency range 100kHz-8.5GHz)
Electrically Conductive Adhesive
• Adhesion on wide range of substrate
• Enhanced adhesion on typical conductive substrat
Adhesive reliability
- Stable physical properties under various ageing conditions
Shielding effectiveness – Influence of aging
- Oxidation of conductive filler influence shielding performance in sheet configuration
- Fully exposed aging (slab) does not represent real fully/partially confined configuration (FIPG) or embedded connection
Adhesive shelf life
- Expected shelf life:minimum 6 months Freezer storage (<-10°C)
- Stable properties under freezer condition (-10°C) up to 5 months (study ongoing)
- Stable properties under refrigerated condition (+3°C) up to minimum 5 weeks
Packaging Homogeneity
- Homogeneous material vs position in the package
- No filler segregation inside the packaging
- Influence of time (settling) together with shelf life
- To eliminate risk of voids → Cartridges need to be stored vertical position tip down
- Tip up or in horizontal position may lead to plunger backward movement due to material weight
UV Indicator
365 nm Optimum inspection wavelength
For more information download here the DOWSIL™ EC-8425 Electrically Conductive Adhesive guide.
