High thermal conductivity material suitable for the protection of automotive electronics and telecommunication devices

Share on linkedin
Share on twitter

Table of Contents

DOWSIL™ TC-4060 GB250 Thermal Gel

DOWSIL™ TC-4060 GB250 Gel is a new, high thermal conductivity material suitable for the protection of automotive electronics and telecommunication devices where heat dissipation is critical.

 

Key benefits:

  • High thermal conductivity 6 W/m.K
  • Soft, stress relieving, shock damping
  • Excellent dispensing
  • Long-term stability in high-temperature and high-power environments
  • Glass bead 250µ to control thickness

 

High power density applications

Automotive electronics

  • Power electronics
    • Converter/inverter
    • OBC
    • ECU

Telecommunication devices

  • Telecom power supply units
  • High frequency devices (5G)

 

SILICONES PORTFOLIO

 

DOWSIL™ TC-4060 Gel / DOWSIL™ TC 4060 GB250 Gel

2K Thermal gel for automotive and telecommunications applications

  • Thermal conductivity ~ 6W/mK; very easy to dispense, soft, low VOC

 

DOWSIL™ TC-4551 CV Gap Filler

2K Gap filler for automotive power applications

  • Thermal conductivity ~5 W/mK, vertical stability before and after curing; very low VOC

 

DOWSIL™ TC-3060 Gel

1K Cold storage (-10°C) thermal gel for telecom applications

  • Thermal conductivity ~6 W/mK, printable

 

DOWSIL™ TC-7006* Gum

1K RT storage thermal gum for 5G

  • Thermal conductivity 6.4 W/mK, self-curing material with excellent vertical stabilit

 

Test Property
Two-part; Mix ratio – 1:1
CTM 0538 Color:
Part A – White
Part B – Blue
ASTM D 2556 Viscosity mPa-Sec:
Part A 1s-1 390.000
Part A 10s-1 140.000
ASTM D792 Specific gravity (g/cm3) Parts A and B: 3.5
ASTM D 2556 Viscosity mPa-Sec:
Part B 1s-1 460.000
Part B 10s-1 140.000
ASTM D 2556 Viscosity (Mixed 1s-1) mPa-Sec: 426.000
ASTM D 5289 Cure time:
At 22°C 24 hours
At 80°C 30 minutes

DOWSIL™ TC-4060 GB250 THERMAL GEL

 

Test Property
ASTM D 1824 Pot life at 22°C : 80 minutes
ASTM D 2440 Durometer Shore 00
after 24 hrs. at 25°C: 55
after 1 hr. at 110°C: 58
E-Modulus by DMA; 0.2 MPa
CTM 0137 Tensile strength 0.05 MPa
ISO2 22007-2 6.5 W/m.K
ASTM D 2440 5.6 W/m.K
Thermal conductivity
6.5 W/m.K
5.6 W/m.K
Coefficient of Thermal Expansion 233 ± 59 ppm/°C
ASTM F 2466 D3-D12 Volatile siloxane content <100 ppm
ASTM D 149 Dielectric strength 8.5 kV/mm
ASTM D 257 Volume resistivity 4×1012 Ω*cm
DAK-TL2 Dielectric constant 10MHz – 20GHz: 7.78
UL 94 V-0 Flammability rating
IEC-60112 Comparative tracking index >600 V
Shelf life <40°C (104°F) 270 days

DOWSIL™ TC-4060 GB250 THERMAL GEL_car

 

THERMAL CONDUCTIVITY

  • Hot Disk: 6.5 W/mK
  • ASTM D5470: 5.6 W/mK

Thermal resistance

Thickness (mm) Rth – (°C x cm 2/W)
0,413 0,747
0,949 1,776
1,944 3,513

DOWSIL™ TC-4060 GB250

 

OPEN TIME AND CURING PROFILE

Open time

  • 80 minutes at room temperature after mixing
  • 24 hours for full cure at room temperature (up to 70 hours in hermetic confinement)
  • Accelerated with 30 minutes at 80°C
  • Fully cured in 1 hour at 100°C

DOWSIL™ TC-4060 GB250_open time

 

SLUMP RESISTANCE VERSUS VERTICAL STABILITY

  • Uncured material doesn’t resist vertical position
  • Cured product survives all aging protocols

 

DOWSIL™ TC-4060 GB250_resistance vs stability

DOWSIL™TC-4060 Gel flipped immediately after dispensing. Picture taken after five minutes

 

HIGH PURITY MATERIAL

Total D3-D12 content below 100 ppm

Client
sample
2 mm for 2 hrs at RT /
24 hrs at 25°C – 50% RH
Part A
30 ml
Part B
30 ml
D3 (ppm) <LOD* <LOD <LOD
D4 (ppm) <LOD <LOD 7
D5 (ppm) <LOD <LOD 6
D6 (ppm) <LOD <LOD <LOD
D7 (ppm) <LOD <LOD <LOD
D8 (ppm) <LOD <LOD <LOD
D9 (ppm) <LOD <LOD <LOD
D10 (ppm) <LOD <LOD <LOD
D11 (ppm) <LOD <LOD <LOD
D12 (ppm) <LOD <LOD <LOD
* Below limit of detection (<LOD)

 

Ionic species below 5 ppm (Na below 10 ppm)

Element DOWSIL™ TC-4060
Gel (1)
DOWSIL™ TC-4060
Gel (2)
Fluoride 0.49 0.49
Chloride 0.33 0.33
Nitrite ND (0.1) ND (0.1)
Sulfate ND (0.1) ND (0.1)
Bromide ND (0.1) ND (0.1)
Nitrate 0.64 0.51
Phosphate ND (0.1) ND (0.1)
Lithium ND (0.1) ND (0.1)
Sodium 5.8 5.2
Ammonium 0.29 0.29
Potassium ND (0.1) ND (0.1)
Magnesium ND (0.1) ND (0.1)
Calcium 0.00 0.00
Results reported in ug/g

 

THERMAL-CONDUCTIVITY AGING

DOWSIL™ TC-4060 GB250_conductivity aging

 

E-MODULUS BY DMA AND CTE

DOWSIL™ TC-4060 GB250_modulus vs curing conditions

 

Dow internal test method

CTE by TMA Value
-40 to 150°C 233 ± 59
ppm/K
-40 to 80°C 201 ± 44
ppm/K

Very minor E-modulus changes during aging test. CTE in range for thermally- conductive silicones.

 

More information in this video

 

 

  • Excellent dispensing performance​ at fast rate
  • Dispensing speed 1.0 ml/sec
    – Higher dispensing speed possible depending on machine conditions
  • CMK > 2.0 for 0.2 ml
  • Helps reduce cycle time
  • Allows intricate design geometries

Dispensing equipment (Scheugenpflugon video)

  • A90 C – Compact Material Feeding System
  • DosP DP803 2C/01 – Volumetric Piston Dispenser
  • DispensingCell DC803 – High Performance Multifunctional Cell

 

Source: Dow Thermally-Conductive Composites Paper

We are your technical partner.

If you have any questions or want to find out more about the possibilities for your industrial application, please complete the contact form and one of our experts will be in touch.

If you have a problem with industrial adhesives, sealants, lubricants or electronic protection products and require advice, you can contact our technical support service. Our team can help you to optimize your processes and applications.

Share this post

Share on linkedin
Share on twitter

Subscribe to our News & Updates

Related Posts

Can't find the right product?

Talk to a Technical Representative

With more than 200 sales professionals into the marketplace, we offer the most compelling local presence in your native language.