DOWSIL™ TC-4060 GB250 Thermal Gel
DOWSIL™ TC-4060 GB250 Gel is a new, high thermal conductivity material suitable for the protection of automotive electronics and telecommunication devices where heat dissipation is critical.
Key benefits:
- High thermal conductivity 6 W/m.K
- Soft, stress relieving, shock damping
- Excellent dispensing
- Long-term stability in high-temperature and high-power environments
- Glass bead 250µ to control thickness
High power density applications
Automotive electronics
- Power electronics
- Converter/inverter
- OBC
- ECU
Telecommunication devices
- Telecom power supply units
- High frequency devices (5G)
SILICONES PORTFOLIO
DOWSIL™ TC-4060 Gel / DOWSIL™ TC 4060 GB250 Gel
2K Thermal gel for automotive and telecommunications applications
- Thermal conductivity ~ 6W/mK; very easy to dispense, soft, low VOC
DOWSIL™ TC-4551 CV Gap Filler
2K Gap filler for automotive power applications
- Thermal conductivity ~5 W/mK, vertical stability before and after curing; very low VOC
DOWSIL™ TC-3060 Gel
1K Cold storage (-10°C) thermal gel for telecom applications
- Thermal conductivity ~6 W/mK, printable
DOWSIL™ TC-7006* Gum
1K RT storage thermal gum for 5G
- Thermal conductivity 6.4 W/mK, self-curing material with excellent vertical stabilit
| Test | Property |
| Two-part; Mix ratio – 1:1 | |
| CTM 0538 | Color: Part A – White Part B – Blue |
| ASTM D 2556 | Viscosity mPa-Sec: Part A 1s-1 390.000 Part A 10s-1 140.000 |
| ASTM D792 | Specific gravity (g/cm3) Parts A and B: 3.5 |
| ASTM D 2556 | Viscosity mPa-Sec: Part B 1s-1 460.000 Part B 10s-1 140.000 |
| ASTM D 2556 | Viscosity (Mixed 1s-1) mPa-Sec: 426.000 |
| ASTM D 5289 | Cure time: At 22°C 24 hours At 80°C 30 minutes |
| Test | Property |
| ASTM D 1824 | Pot life at 22°C : 80 minutes |
| ASTM D 2440 | Durometer Shore 00 after 24 hrs. at 25°C: 55 after 1 hr. at 110°C: 58 |
| E-Modulus by DMA; 0.2 MPa | |
| CTM 0137 | Tensile strength 0.05 MPa |
| ISO2 22007-2 6.5 W/m.K ASTM D 2440 5.6 W/m.K |
Thermal conductivity 6.5 W/m.K 5.6 W/m.K |
| Coefficient of Thermal Expansion 233 ± 59 ppm/°C | |
| ASTM F 2466 | D3-D12 Volatile siloxane content <100 ppm |
| ASTM D 149 | Dielectric strength 8.5 kV/mm |
| ASTM D 257 | Volume resistivity 4×1012 Ω*cm |
| DAK-TL2 | Dielectric constant 10MHz – 20GHz: 7.78 |
| UL 94 | V-0 Flammability rating |
| IEC-60112 | Comparative tracking index >600 V |
| Shelf life <40°C (104°F) 270 days |
THERMAL CONDUCTIVITY
- Hot Disk: 6.5 W/mK
- ASTM D5470: 5.6 W/mK
Thermal resistance
| Thickness (mm) | Rth – (°C x cm 2/W) |
| 0,413 | 0,747 |
| 0,949 | 1,776 |
| 1,944 | 3,513 |
OPEN TIME AND CURING PROFILE
Open time
- 80 minutes at room temperature after mixing
- 24 hours for full cure at room temperature (up to 70 hours in hermetic confinement)
- Accelerated with 30 minutes at 80°C
- Fully cured in 1 hour at 100°C
SLUMP RESISTANCE VERSUS VERTICAL STABILITY
- Uncured material doesn’t resist vertical position
- Cured product survives all aging protocols
DOWSIL™TC-4060 Gel flipped immediately after dispensing. Picture taken after five minutes
HIGH PURITY MATERIAL
Total D3-D12 content below 100 ppm
| Client sample |
2 mm for 2 hrs at RT / 24 hrs at 25°C – 50% RH |
Part A 30 ml |
Part B 30 ml |
| D3 (ppm) | <LOD* | <LOD | <LOD |
| D4 (ppm) | <LOD | <LOD | 7 |
| D5 (ppm) | <LOD | <LOD | 6 |
| D6 (ppm) | <LOD | <LOD | <LOD |
| D7 (ppm) | <LOD | <LOD | <LOD |
| D8 (ppm) | <LOD | <LOD | <LOD |
| D9 (ppm) | <LOD | <LOD | <LOD |
| D10 (ppm) | <LOD | <LOD | <LOD |
| D11 (ppm) | <LOD | <LOD | <LOD |
| D12 (ppm) | <LOD | <LOD | <LOD |
| * Below limit of detection (<LOD) | |||
Ionic species below 5 ppm (Na below 10 ppm)
| Element | DOWSIL™ TC-4060 Gel (1) |
DOWSIL™ TC-4060 Gel (2) |
| Fluoride | 0.49 | 0.49 |
| Chloride | 0.33 | 0.33 |
| Nitrite | ND (0.1) | ND (0.1) |
| Sulfate | ND (0.1) | ND (0.1) |
| Bromide | ND (0.1) | ND (0.1) |
| Nitrate | 0.64 | 0.51 |
| Phosphate | ND (0.1) | ND (0.1) |
| Lithium | ND (0.1) | ND (0.1) |
| Sodium | 5.8 | 5.2 |
| Ammonium | 0.29 | 0.29 |
| Potassium | ND (0.1) | ND (0.1) |
| Magnesium | ND (0.1) | ND (0.1) |
| Calcium | 0.00 | 0.00 |
| Results reported in ug/g | ||
THERMAL-CONDUCTIVITY AGING
E-MODULUS BY DMA AND CTE
Dow internal test method
| CTE by TMA | Value |
| -40 to 150°C | 233 ± 59 ppm/K |
| -40 to 80°C | 201 ± 44 ppm/K |
Very minor E-modulus changes during aging test. CTE in range for thermally- conductive silicones.
More information in this video
- Excellent dispensing performance at fast rate
- Dispensing speed 1.0 ml/sec
– Higher dispensing speed possible depending on machine conditions - CMK > 2.0 for 0.2 ml
- Helps reduce cycle time
- Allows intricate design geometries
Dispensing equipment (Scheugenpflugon video)
- A90 C – Compact Material Feeding System
- DosP DP803 2C/01 – Volumetric Piston Dispenser
- DispensingCell DC803 – High Performance Multifunctional Cell
Source: Dow Thermally-Conductive Composites Paper
