Dowsil 7094 – Silicone Adhesive and Sealant

Applications

• Sealing and bonding application where low viscosity and self-leveling properties in combination with non-corrosive cure is required
• Designed for applications which demand a strong but flexible bond such as when bonding materials with differing thermal expansion rates e.g., glass to metal or glass to plastic
• Low modulus formulation for high movement capability
• Sealing in gaps where an elastic grouting is required

Features

• One component adhesive/sealant
• Cures at room temperature when exposed to moisture in the air
• Alkoxy cure system
• Flowable and self-leveling
• Easy to apply
• Excellent unprimed adhesion to many substrates
• Stable and flexible from -50°C to 180°C
• Non-corrosive to metals
• Low odor
• Unprimed adhesion to mixed substrates