Dow at Bondexpo 2018 in Stuttgart. International trade fair for bonding technology

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Our partners Dow are exhibiting at the Bondexpo 2018 in Stuttgart, from October 8th until 11th. The Bondexpo has established itself as a global industry and users meeting point. It represents the entire process chain of assembling and joining by bonding, potting, sealing and foaming and offers solutions for practical applications and future challenges facing the industrydow bondexpo 2018

Dow is presenting their DowsilTM silicone adhesives and sealants. These high performance silicon-based adhesive and sealants are long lasting, weather resistant and suitable for many applications.

Visit Dow at booth 6522 at hall 6.

Let’s Bond Together – We Have Your Ticket

dow bondexpo 2018

On behalf of Dow, we want you to be our special guest and offer you a free entrance ticket to the 12th Bondexpo in Stuttgart, Germany, held 8-11 October. Because these free ticket quantities are limited, please don’t hesitate. Request your free entrance ticket now, while the supply lasts.

You’re Invited to an After-Hours Party

We have a lot to share with you at our first Bondexpo exhibit, and are hosting a private, after-hours party in Exhibition Hall 6, Booth 6522. It’s by invitation only – and you’re invited.

Please RSVP by 28 September by selecting one of these times:

And There’s More … Demonstrations

See the new DOWSIL™ HM-2600 Silicone Assembly Sealant in action using thermoforming and robotic equipment, in the Dow booth. Don’t miss these live demos – at the top of each hour throughout the show.

Dow look forward to seeing you in Stuttgart.

We are your technical partner.

If you have any questions or want to find out more about the possibilities for your industrial application, please complete the contact form and one of our experts will be in touch.

If you have a problem with industrial adhesives, sealants, lubricants or electronic protection products and require advice, you can contact our technical support service. Our team can help you to optimize your processes and applications.

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