Merbenit at Bondexpo 2018 – International trade fair for bonding technology

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Our partners Merz and Benteli are exhibiting at the Bondexpo 2018 in Stuttgart, from October 8th until 11th. The Bondexpo has established itself as a global industry and users meeting point. It represents the entire process chain of assembling and joining by bonding, potting, sealing and foaming and offers solutions for practical applications and future challenges facing the industry

Merbenit at 12th Bondexpo in Stuttgart, 8th to 11th October 2018

Merz & Benteli is presenting their Merbenit range, a flexible and versatile MSP adhesives & sealant range in line with today‘s requirements:. Merbenit provides innovative solutions for demanding customer requirements.

Visit Merbenit at stand 6300 in hall 6. They are looking forward to meeting you there!

By using the following link you can register and print your ticket for the trade fair.

New Merbenit Brochure

We revised our Merbenit print media and will present them for the first time at the Bondexpo 2018. The new Merbenit brochure containing the whole product range is now available in German and English.

You can download the PDF from our dropbox.

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