DOWSIL™ EC-8425 Adhesive

DOWSIL™ EC-8425 Adhesive

Table of Contents

DOWSIL™ EC-8425 is a new 1-part heat cure Electrically Conductive Adhesive for grounding, bonding and shielding interference applications with durable mechanical and conductive properties and reliable performance at high temperature and vibration.

Key benefits

  • Durable mechanical and conductive properties
  • Reliable performance that can withstand high temperature and vibration
  • Strong adhesion
  • Strong electromagnetic shielding across a wide range of frequencies
  • Cure at medium temperatures (~90°C)
  • 20% elongation at medium cure T° to enable flexibility at joints​
  • Balancing cost and performance
  • Added UV indicator for ease of inspection
  • Solvent-free

Automotive Applications

  • EMI/EMC shielding
  • Electrical connection – grounding

Targeting

  • ADAS (Advanced Driver Assistance Systems) ▪ Inverter/Converter
  • Electronic Control Unit
  • Sensors

DOWSIL™ EC-8425 Electrically Conductive Adhesive

  • Durable mechanical and conductive properties, reliable performance
  • Withstands high temperature and vibration
  • Balanced cost and performance enable use in wide variety of grounding applications
  • Cure at medium temperatures ≥ 90 °C (gelation onset 80°C, 30 min)
  • Greater than 20% elongation to enable flexibility at joints​
  • Potential applications include solder and mechanical fastener replacement
  • Formulated with blend of silver & sliver platted filler

 

 

Properties

 

Property comparisons

Property comparisons DOWSIL™ EC8425

Adhesive rheology

Viscosity:

  • 2800 Pa.s @ 0.1(1/s)
  • 400 Pa.s @ 1 (1/s)

Thixotropic index (0.1/1): 7

Electrically Conductive Adhesive

Open time

  • >5 Days at room temperature
  • Increase of viscosity/decrease of extrusion is leading factor
  • Stable adhesion and bond line thickness

DOWSILTM EC-8425 Adhesive BLT vs open time at varied pressure

DOWSILTM EC-8425 open time

Adhesive cure properties

  • Stable properties under various cure conditions
  • Initial variation in adhesion vs cure condition recovered with time at cure temperature

Adhesive cure properties

Adhesive shielding effectiveness

  • Strong shielding across wide range of frequency
  • Average -81dB (frequency range 100kHz-8.5GHz)

Shielding effectiveness DOWSIL EC-8425

Electrically Conductive Adhesive

• Adhesion on wide range of substrate
• Enhanced adhesion on typical conductive substrat

DOWSIL EC-8425 Lap shear

Adhesive reliability

  • Stable physical properties under various ageing conditions

Shielding effectiveness – Influence of aging

  • Oxidation of conductive filler influence shielding performance in sheet configuration
  • Fully exposed aging (slab) does not represent real fully/partially confined configuration (FIPG) or embedded connection

Adhesive shelf life

  • Expected shelf life:minimum 6 months Freezer storage (<-10°C)
  • Stable properties under freezer condition (-10°C) up to 5 months (study ongoing)
  • Stable properties under refrigerated condition (+3°C) up to minimum 5 weeks

Packaging Homogeneity

  • Homogeneous material vs position in the package
  • No filler segregation inside the packaging
  • Influence of time (settling) together with shelf life

PACKAGING HOMOGENEITY DOWSIL™ EC-8425

  • To eliminate risk of voids → Cartridges need to be stored vertical position tip down
  • Tip up or in horizontal position may lead to plunger backward movement due to material weight

UV Indicator

365 nm Optimum inspection wavelength

UV INDICATOR DOWSIL™ EC-8425

For more information download here the DOWSIL™ EC-8425 Electrically Conductive Adhesive guide.

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