
Dielectric gels for potting and protecting PCB & power modules
Increasingly, industry trends demand small components with higher power densities. These trends require a reliance on stronger gels that protect assemblies and their properties. DOWSIL™
Increasingly, industry trends demand small components with higher power densities. These trends require a reliance on stronger gels that protect assemblies and their properties. DOWSIL™
Solid Foundation for Subcomponents and Larger Assemblies Adhesives and sealants play a crucial role in the structural integrity of LED lamps and luminaires, shielding electronics
New room-temperature cure formulation delivers primerless adhesion within minutes to most substrates and provides long-lasting reliability under demanding conditions. Dow Performance Silicones, a global leader
EnLighten your luminaire with new patented DOWSILTM EI-2888 Primerless Silicone encapsulant. This innovative solution will help you in addressing the processing and cost challenges by providing
Professional grade sealants effective, reliable and cost-efficient solutions Effective, economical solutions for specified and general-purpose applications: The products of Dow’s nearly 70 years of silicone
IMAGINE improved thermal conductivity – easier processing and long-term performance stability DESCRIPTION DOWSIL™ thermally conductive gap fillers are soft, compressible, two-part, high-thermalconductivity silicone materials specifically
DOWSIL™ EA-5151 Adhesive Delivers Enhanced Productivity in Automotive Electronics Applications Advanced Assembly Solutions for a Tier 1 Automotive Supplier The Challenge Buyers want vehicles that are
Encapsulants and Gels Selection Guide Minimizing Stress to Maximize Reliability with Proven Silicone Encapsulants and Gels Why Choose a Silicone Encapsulant or Gel versus a
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